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Wafer thin floating suction cup for confined automation processes

Home Engineering Pumps, Valves, Hydraulics, Pneumatics Wafer thin floating suction cup for confined automation processes

THE recently launched floating suction cups SBS with thin geometry, by Schmalz, is only 2 mm high. Both the gripper and vacuum-generator are contained in only one component, and low-contact gripping makes them ideal for sensitive workpieces like thin copper foils and substrates.

The minimal height means effective handling of very low-profile products like printed circuit boards, drilled PCBs and wafers, for example, as well as loading and unloading transport cassettes and separating thin, porous workpieces reliably.

Their limited size and gentle handling of workpieces with slightly structured surfaces makes them suitable for use in most automation processes with limited accessibility. The suction cup “floats” on an air cushion with its flat geometry exerting high holding forces. As small as it is, the unit’s integrated vacuum generation is still based on the Bernoulli principle.

“Absolutely no air is drawn through workpieces and the fact that compressed air is used to operate the component means that no dirt can be sucked in, ensuring a clean vacuum-line,” said Wade Profitt, Pneumatic Product Manager, Tectra Automation.

Additional benefits are that no ejector is required and the cups can be used on robots of any brand. “They are, essentially, high-performance suction cups that are ideal for use in most confined automation processes.”

Launched worldwide in June this year, the Schmalz floating suction cup SBS with thin geometry has already received positive feedback from the semi-conductor and electronics markets.

It is available from Tectra Automation, a Bosch Rexroth South Africa Group Company and exclusive supplier of Schmalz products in sub-Saharan Africa.

 

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